</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8461.90.60.40/Rebuilt Wafer Slicing Diamond Saw/Canada

Rebuilt Wafer Slicing Diamond Saw from Canada

Refurbished inner-diameter saw with diamond blade for precision slicing of semiconductor wafers from silicon boules. Falls under HTS 8461.90.60.40 as rebuilt sawing machine removing metal/cermets in semiconductor processing.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Calculate with your customs valueVerify classification with AI

Import Tips

• Certify diamond blade thickness and kerf specs for wafer tolerance compliance

• Provide slicing test data showing sub-micron accuracy

• Declare as semiconductor-specific to avoid general saw classification

Rebuilt Wafer Slicing Diamond Saw from Canada — Import Duty Rate | HTS 8461.90.60.40