Rebuilt Wafer Slicing Diamond Saw from Germany
Refurbished inner-diameter saw with diamond blade for precision slicing of semiconductor wafers from silicon boules. Falls under HTS 8461.90.60.40 as rebuilt sawing machine removing metal/cermets in semiconductor processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Certify diamond blade thickness and kerf specs for wafer tolerance compliance
• Provide slicing test data showing sub-micron accuracy
• Declare as semiconductor-specific to avoid general saw classification