Used Crystal Boule Grinder
Reconditioned grinding machine that shapes semiconductor crystal boules to exact diameters and flats indicating conductivity type. HTS 8461.90.60.40 applies as a used metal-removal tool for cermet/semiconductor material preparation per statistical notes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified as semiconductor wafer preparation equipment
Statistical notes specify crystal grinders under wafer manufacturing in 8460.
If not rebuilt but merely used without refurbishment
Non-rebuilt used machines may fall under general other category.
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Import Tips & Compliance
• Document flat/grinding precision capabilities to prove semiconductor-specific use
• Include wear-part replacement records for Customs valuation
• Ensure dust collection system meets EPA import standards
Related Products under HTS 8461.90.60.40
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Reconditioned shaping machine for custom crystal geometries in compound semiconductor production. HTS 8461.90.60.40 for used shaping tools working cermets.
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Refurbished machine for final gear finishing on cermet components used in semiconductor handlers. Classified HTS 8461.90.60.40 for rebuilt gear finishing tools.
Used boule Diameter Grinder
Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.
Rebuilt Semiconductor Broaching Machine
Refurbished broaching tool for creating precise keyways in semiconductor equipment components. Falls under HTS 8461.90.60.40 as rebuilt broaching machine tool.
Used Wafer Slotting Saw
Rebuilt precision saw for creating alignment slots/notches on semiconductor wafers. HTS 8461.90.60.40 covers used slotting machine tools.
Used Czochralski Crystal Puller
A rebuilt machine tool used to grow monocrystalline silicon boules via the Czochralski method by precisely pulling and rotating a seed crystal from molten silicon. It falls under HTS 8461.90.60.40 as a used or rebuilt machine tool working by removing metal or cermets through grinding and shaping processes on crystal boules. This equipment prepares semiconductor material for wafer production.