Rebuilt Wafer Polishing Machine
Refurbished chemical-mechanical polisher (CMP) for final wafer surface preparation. Classified under HTS 8461.90.60.40 as rebuilt machine removing cermets via polishing action.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified by polishing mechanism
Centrifugal polishing machines have separate heading.
If semiconductor thermal processing equipment
CMP may overlap with thermal processing if heated.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Document pad conditioning and slurry flow specifications
• Provide removal rate and non-uniformity data
• Ensure chemical containment certification
Related Products under HTS 8461.90.60.40
Used Semiconductor Crystal Shaper
Reconditioned shaping machine for custom crystal geometries in compound semiconductor production. HTS 8461.90.60.40 for used shaping tools working cermets.
Rebuilt Cermet Gear Finishing Machine
Refurbished machine for final gear finishing on cermet components used in semiconductor handlers. Classified HTS 8461.90.60.40 for rebuilt gear finishing tools.
Used boule Diameter Grinder
Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.
Rebuilt Semiconductor Broaching Machine
Refurbished broaching tool for creating precise keyways in semiconductor equipment components. Falls under HTS 8461.90.60.40 as rebuilt broaching machine tool.
Used Wafer Slotting Saw
Rebuilt precision saw for creating alignment slots/notches on semiconductor wafers. HTS 8461.90.60.40 covers used slotting machine tools.
Used Czochralski Crystal Puller
A rebuilt machine tool used to grow monocrystalline silicon boules via the Czochralski method by precisely pulling and rotating a seed crystal from molten silicon. It falls under HTS 8461.90.60.40 as a used or rebuilt machine tool working by removing metal or cermets through grinding and shaping processes on crystal boules. This equipment prepares semiconductor material for wafer production.