Rebuilt Wafer Polishing Machine from Japan
Refurbished chemical-mechanical polisher (CMP) for final wafer surface preparation. Classified under HTS 8461.90.60.40 as rebuilt machine removing cermets via polishing action.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document pad conditioning and slurry flow specifications
• Provide removal rate and non-uniformity data
• Ensure chemical containment certification