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8461.90.60.40/Rebuilt Wafer Polishing Machine/Japan

Rebuilt Wafer Polishing Machine from Japan

Refurbished chemical-mechanical polisher (CMP) for final wafer surface preparation. Classified under HTS 8461.90.60.40 as rebuilt machine removing cermets via polishing action.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document pad conditioning and slurry flow specifications

• Provide removal rate and non-uniformity data

• Ensure chemical containment certification

Rebuilt Wafer Polishing Machine from Japan — Import Duty Rate | HTS 8461.90.60.40