8461.90.60.40/Rebuilt Wafer Polishing Machine/Mexico

Rebuilt Wafer Polishing Machine from Mexico

Refurbished chemical-mechanical polisher (CMP) for final wafer surface preparation. Classified under HTS 8461.90.60.40 as rebuilt machine removing cermets via polishing action.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document pad conditioning and slurry flow specifications

• Provide removal rate and non-uniformity data

• Ensure chemical containment certification

Rebuilt Wafer Polishing Machine from Mexico — Import Duty Rate | HTS 8461.90.60.40