Rebuilt Wafer Polishing Machine from Mexico
Refurbished chemical-mechanical polisher (CMP) for final wafer surface preparation. Classified under HTS 8461.90.60.40 as rebuilt machine removing cermets via polishing action.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document pad conditioning and slurry flow specifications
• Provide removal rate and non-uniformity data
• Ensure chemical containment certification