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8461.90.60.40/Rebuilt Wafer Polishing Machine/Mexico

Rebuilt Wafer Polishing Machine from Mexico

Refurbished chemical-mechanical polisher (CMP) for final wafer surface preparation. Classified under HTS 8461.90.60.40 as rebuilt machine removing cermets via polishing action.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document pad conditioning and slurry flow specifications

• Provide removal rate and non-uniformity data

• Ensure chemical containment certification