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8461.90.60.40/Rebuilt Wafer Polishing Machine/Germany

Rebuilt Wafer Polishing Machine from Germany

Refurbished chemical-mechanical polisher (CMP) for final wafer surface preparation. Classified under HTS 8461.90.60.40 as rebuilt machine removing cermets via polishing action.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Document pad conditioning and slurry flow specifications

• Provide removal rate and non-uniformity data

• Ensure chemical containment certification

Rebuilt Wafer Polishing Machine from Germany — Import Duty Rate | HTS 8461.90.60.40