Rebuilt Semiconductor Wafer Lapper
Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If wafer preparation grinders/lappers/polishers
Directly specified in statistical notes for semiconductor wafer prep.
If centrifugal apparatus for lapping slurry distribution
Centrifuges have separate classification.
Not sure which classification is right?
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Import Tips & Compliance
• Include flatness measurement data (e.g
• <1 micron) proving semiconductor use
• Document slurry system materials for chemical compatibility
• Register for potential BIS export control review
Related Products under HTS 8461.90.60.40
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Used boule Diameter Grinder
Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.
Rebuilt Semiconductor Broaching Machine
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Used Wafer Slotting Saw
Rebuilt precision saw for creating alignment slots/notches on semiconductor wafers. HTS 8461.90.60.40 covers used slotting machine tools.
Used Czochralski Crystal Puller
A rebuilt machine tool used to grow monocrystalline silicon boules via the Czochralski method by precisely pulling and rotating a seed crystal from molten silicon. It falls under HTS 8461.90.60.40 as a used or rebuilt machine tool working by removing metal or cermets through grinding and shaping processes on crystal boules. This equipment prepares semiconductor material for wafer production.