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Rebuilt Semiconductor Wafer Lapper

Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+37.5%41.9%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+12.5%12.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.29.01Same rate: 41.9%

If wafer preparation grinders/lappers/polishers

Directly specified in statistical notes for semiconductor wafer prep.

8421.19.00Lower: 38.8% vs 41.9%

If centrifugal apparatus for lapping slurry distribution

Centrifuges have separate classification.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Include flatness measurement data (e.g

• <1 micron) proving semiconductor use

• Document slurry system materials for chemical compatibility

• Register for potential BIS export control review