Rebuilt Semiconductor Wafer Lapper from Mexico
Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Include flatness measurement data (e.g
• <1 micron) proving semiconductor use
• Document slurry system materials for chemical compatibility
• Register for potential BIS export control review