Rebuilt Semiconductor Wafer Lapper from Mexico
Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include flatness measurement data (e.g
• <1 micron) proving semiconductor use
• Document slurry system materials for chemical compatibility
• Register for potential BIS export control review