Rebuilt Semiconductor Wafer Lapper from Germany
Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include flatness measurement data (e.g
• <1 micron) proving semiconductor use
• Document slurry system materials for chemical compatibility
• Register for potential BIS export control review