8461.90.60.40/Rebuilt Semiconductor Wafer Lapper/Japan

Rebuilt Semiconductor Wafer Lapper from Japan

Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include flatness measurement data (e.g

• <1 micron) proving semiconductor use

• Document slurry system materials for chemical compatibility

• Register for potential BIS export control review