Rebuilt Semiconductor Wafer Lapper from Japan
Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include flatness measurement data (e.g
• <1 micron) proving semiconductor use
• Document slurry system materials for chemical compatibility
• Register for potential BIS export control review