8461.90.60.40/Rebuilt Semiconductor Wafer Lapper/Japan

Rebuilt Semiconductor Wafer Lapper from Japan

Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Include flatness measurement data (e.g

• <1 micron) proving semiconductor use

• Document slurry system materials for chemical compatibility

• Register for potential BIS export control review