Other, valued under $3,025 each

Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Other: > Other > Other: > Other, valued under $3,025 each

Duty Rate (from China)

39.4%
MFN Base Rate4.4%

Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Total Effective Rate39.4%

Products classified under HTS 8461.90.60.50

Benchtop CNC Gear Hobbing Machine

A compact CNC machine tool designed for hobbing precise gears on small components by removing metal shavings. It falls under HTS 8461.90.60.50 as a gear cutting machine tool valued under $3,025 each, used in low-volume production or prototyping. Primarily employed in workshops for automotive and machinery gear manufacturing.

Mini Wafer Slicing Saw

Precision diamond saw for slicing semiconductor crystal boules into thin wafers by removing minimal material. Classified in HTS 8461.90.60.50 as a sawing machine tool for cermets/semiconductors, valued under $3,025. Essential for semiconductor wafer manufacturing per statistical notes.

Crystal Boule Grinder

Machine for grinding semiconductor crystal boules to exact diameter and flats indicating conductivity. HTS 8461.90.60.50 applies to this metal/cermet removing grinder valued under $3,025, matching statistical note for wafer prep equipment.

Portable Gear Finishing Shaper

Handheld shaper for final finishing cuts on small gears by metal removal. Fits HTS 8461.90.60.50 for other low-value shaping machine tools under $3,025 each.

Small Cermet Slotting Machine

Benchtop tool for cutting slots in cermet materials used in tooling inserts. HTS 8461.90.60.50 covers this slotting machine valued under $3,025 for cermet work.

Entry-Level Wafer Lapping Machine

Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.

Budget CNC Broaching Tool

Affordable CNC broach for internal/external shapes in small metal parts. HTS 8461.90.60.50 for other broaching machines valued under $3,025.

Compact Semiconductor Wafer Polisher

Tabletop polisher for final surface finish on silicon wafers via cermet removal. Classified HTS 8461.90.60.50 as low-value wafer polishing machine per statistical note.

DIY Metal Planer Tool

Small planing machine for hobbyist metal surfacing by chip removal. Fits HTS 8461.90.60.50 for other low-value planing tools.

Micro Gear Grinding Attachment

Attachable grinder for finishing micro-gears by cermet abrasion. HTS 8461.90.60.50 as low-value gear finishing tool.