Crystal Boule Grinder
Machine for grinding semiconductor crystal boules to exact diameter and flats indicating conductivity. HTS 8461.90.60.50 applies to this metal/cermet removing grinder valued under $3,025, matching statistical note for wafer prep equipment.
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Import Tips & Compliance
• Include boule diameter specs and flat grinding tolerances in entry docs for verification
• Label as 'semiconductor equipment' to prevent misclassification as general grinding tools
• Avoid bundling with testing apparatus to stay out of Chapter 90
Related Products under HTS 8461.90.60.50
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A compact CNC machine tool designed for hobbing precise gears on small components by removing metal shavings. It falls under HTS 8461.90.60.50 as a gear cutting machine tool valued under $3,025 each, used in low-volume production or prototyping. Primarily employed in workshops for automotive and machinery gear manufacturing.
Mini Wafer Slicing Saw
Precision diamond saw for slicing semiconductor crystal boules into thin wafers by removing minimal material. Classified in HTS 8461.90.60.50 as a sawing machine tool for cermets/semiconductors, valued under $3,025. Essential for semiconductor wafer manufacturing per statistical notes.
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Benchtop tool for cutting slots in cermet materials used in tooling inserts. HTS 8461.90.60.50 covers this slotting machine valued under $3,025 for cermet work.
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Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.
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