Budget CNC Broaching Tool
Affordable CNC broach for internal/external shapes in small metal parts. HTS 8461.90.60.50 for other broaching machines valued under $3,025.
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• Provide broach pull force ratings and shape geometries in tech docs
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Related Products under HTS 8461.90.60.50
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A compact CNC machine tool designed for hobbing precise gears on small components by removing metal shavings. It falls under HTS 8461.90.60.50 as a gear cutting machine tool valued under $3,025 each, used in low-volume production or prototyping. Primarily employed in workshops for automotive and machinery gear manufacturing.
Mini Wafer Slicing Saw
Precision diamond saw for slicing semiconductor crystal boules into thin wafers by removing minimal material. Classified in HTS 8461.90.60.50 as a sawing machine tool for cermets/semiconductors, valued under $3,025. Essential for semiconductor wafer manufacturing per statistical notes.
Crystal Boule Grinder
Machine for grinding semiconductor crystal boules to exact diameter and flats indicating conductivity. HTS 8461.90.60.50 applies to this metal/cermet removing grinder valued under $3,025, matching statistical note for wafer prep equipment.
Portable Gear Finishing Shaper
Handheld shaper for final finishing cuts on small gears by metal removal. Fits HTS 8461.90.60.50 for other low-value shaping machine tools under $3,025 each.
Small Cermet Slotting Machine
Benchtop tool for cutting slots in cermet materials used in tooling inserts. HTS 8461.90.60.50 covers this slotting machine valued under $3,025 for cermet work.
Entry-Level Wafer Lapping Machine
Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.