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Mini Wafer Slicing Saw

Precision diamond saw for slicing semiconductor crystal boules into thin wafers by removing minimal material. Classified in HTS 8461.90.60.50 as a sawing machine tool for cermets/semiconductors, valued under $3,025. Essential for semiconductor wafer manufacturing per statistical notes.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+37.5%41.9%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+12.5%12.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8479.89.65.00Lower: 22.5% vs 41.9%

If

8461.50.40Same rate: 41.9%

If

9017.20.70.00Lower: 37.5% vs 41.9%

If

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Provide evidence of semiconductor end-use via end-user certificates to justify 8461 classification

• Document diamond blade specs and precision tolerances to distinguish from general saws

• Ensure cleanroom compatibility certifications if marketing for chip fabrication