Crystal Boule Grinder from Japan
Machine for grinding semiconductor crystal boules to exact diameter and flats indicating conductivity. HTS 8461.90.60.50 applies to this metal/cermet removing grinder valued under $3,025, matching statistical note for wafer prep equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include boule diameter specs and flat grinding tolerances in entry docs for verification
• Label as 'semiconductor equipment' to prevent misclassification as general grinding tools
• Avoid bundling with testing apparatus to stay out of Chapter 90