Crystal Boule Grinder from Japan
Machine for grinding semiconductor crystal boules to exact diameter and flats indicating conductivity. HTS 8461.90.60.50 applies to this metal/cermet removing grinder valued under $3,025, matching statistical note for wafer prep equipment.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include boule diameter specs and flat grinding tolerances in entry docs for verification
• Label as 'semiconductor equipment' to prevent misclassification as general grinding tools
• Avoid bundling with testing apparatus to stay out of Chapter 90