Crystal Boule Grinder from China
Machine for grinding semiconductor crystal boules to exact diameter and flats indicating conductivity. HTS 8461.90.60.50 applies to this metal/cermet removing grinder valued under $3,025, matching statistical note for wafer prep equipment.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include boule diameter specs and flat grinding tolerances in entry docs for verification
• Label as 'semiconductor equipment' to prevent misclassification as general grinding tools
• Avoid bundling with testing apparatus to stay out of Chapter 90