Compact Semiconductor Wafer Polisher
Tabletop polisher for final surface finish on silicon wafers via cermet removal. Classified HTS 8461.90.60.50 as low-value wafer polishing machine per statistical note.
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Import Tips & Compliance
• Document polish pad materials and removal rates for semiconductor validation
• Include cleanroom class ratings for import inspection
• Value polishing slurries separately to preserve machine threshold
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A compact CNC machine tool designed for hobbing precise gears on small components by removing metal shavings. It falls under HTS 8461.90.60.50 as a gear cutting machine tool valued under $3,025 each, used in low-volume production or prototyping. Primarily employed in workshops for automotive and machinery gear manufacturing.
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Precision diamond saw for slicing semiconductor crystal boules into thin wafers by removing minimal material. Classified in HTS 8461.90.60.50 as a sawing machine tool for cermets/semiconductors, valued under $3,025. Essential for semiconductor wafer manufacturing per statistical notes.
Crystal Boule Grinder
Machine for grinding semiconductor crystal boules to exact diameter and flats indicating conductivity. HTS 8461.90.60.50 applies to this metal/cermet removing grinder valued under $3,025, matching statistical note for wafer prep equipment.
Portable Gear Finishing Shaper
Handheld shaper for final finishing cuts on small gears by metal removal. Fits HTS 8461.90.60.50 for other low-value shaping machine tools under $3,025 each.
Small Cermet Slotting Machine
Benchtop tool for cutting slots in cermet materials used in tooling inserts. HTS 8461.90.60.50 covers this slotting machine valued under $3,025 for cermet work.
Entry-Level Wafer Lapping Machine
Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.