8461.90.60.50/Compact Semiconductor Wafer Polisher/Japan

Compact Semiconductor Wafer Polisher from Japan

Tabletop polisher for final surface finish on silicon wafers via cermet removal. Classified HTS 8461.90.60.50 as low-value wafer polishing machine per statistical note.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document polish pad materials and removal rates for semiconductor validation

• Include cleanroom class ratings for import inspection

• Value polishing slurries separately to preserve machine threshold