Compact Semiconductor Wafer Polisher from Germany
Tabletop polisher for final surface finish on silicon wafers via cermet removal. Classified HTS 8461.90.60.50 as low-value wafer polishing machine per statistical note.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document polish pad materials and removal rates for semiconductor validation
• Include cleanroom class ratings for import inspection
• Value polishing slurries separately to preserve machine threshold