Compact Semiconductor Wafer Polisher from Mexico
Tabletop polisher for final surface finish on silicon wafers via cermet removal. Classified HTS 8461.90.60.50 as low-value wafer polishing machine per statistical note.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document polish pad materials and removal rates for semiconductor validation
• Include cleanroom class ratings for import inspection
• Value polishing slurries separately to preserve machine threshold