Silicon Wafer Back Grinder from Mexico
Precision grinder that thins silicon wafers from the backside to target thickness (e.g., 50-100 microns) for advanced packaging. HTS 8461.90.60 applies as wafer preparation equipment removing semiconductor cermet material.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify minimum achievable thickness in technical literature submitted
• Classify tape frames separately if imported together