Float Zone Crystal Grower
Equipment employing the float zone method to produce high-purity silicon crystals by zone melting and shaping. It integrates sawing and grinding to slice and finish boules into wafer-ready forms, falling under HTS 8461.90.60 for other machine tools removing metal in semiconductor processing.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If thermal processing equipment without cutting or grinding
Heading 8486 covers semiconductor thermal machines excluding mechanical removal tools.
If equipped for testing crystal resistivity rather than shaping
Testing apparatus moves to Chapter 90 machines and appliances.
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Import Tips & Compliance
• Include process flow diagrams showing metal/cermet removal steps for accurate HTS verification
• Ensure labeling complies with semiconductor equipment standards to prevent delays
Related Products under HTS 8461.90.60
Multi-Wire Wafer Saw
Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.
Stress Relief Wafer Grinder
Grinds wafer edges to remove stress-induced microcracks from slicing, preventing breakage in later processing. Specialized semiconductor grinder under HTS 8461.90.60 per statistical notes.
Wafer Surface Lapper
Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.
Diamond Wafer Polishing Machine
Uses diamond slurry and pads to polish semiconductor wafers to mirror finish required for lithography. Mechanical polishing action removes cermet, placing it under HTS 8461.90.60 statistical note (a)(ii)(C).
Crystal Ingot Notcher
Machine that notches silicon ingots to precise flats indicating crystal orientation and doping. Performs slotting/planing operations removing material, thus HTS 8461.90.60 for semiconductor boule preparation.
Czochralski Crystal Puller
A machine tool used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski method. It removes excess material through precise shaping and grinding processes to achieve the required boule diameter and flats, classifying it under HTS 8461.90.60 as other semiconductor manufacturing equipment involving metal/cermet removal.