8461.90.60/Float Zone Crystal Grower/Japan

Float Zone Crystal Grower from Japan

Equipment employing the float zone method to produce high-purity silicon crystals by zone melting and shaping. It integrates sawing and grinding to slice and finish boules into wafer-ready forms, falling under HTS 8461.90.60 for other machine tools removing metal in semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include process flow diagrams showing metal/cermet removal steps for accurate HTS verification

• Ensure labeling complies with semiconductor equipment standards to prevent delays