Wafer Lapping Machine
Double-sided lapping equipment that abrades both surfaces of semiconductor wafers to achieve flatness tolerances critical for fabrication. Falls under HTS 8461.90.60 per statistical note (a)(ii)(C) for wafer preparation by material removal.
Import Duty Rates by Country of Origin
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If lapping/polishing for general metal or cermet workpieces
Heading 8460 covers honing/lapping machines not specific to wafers.
If integrated with optical testing functions
Machines combining polishing with optical inspection may go to Chapter 90.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include flatness specification sheets (e.g
• <1 micron) in entry docs
• Bond equipment under temporary import if for testing/demos
Related Products under HTS 8461.90.60
Multi-Wire Wafer Saw
Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.
Stress Relief Wafer Grinder
Grinds wafer edges to remove stress-induced microcracks from slicing, preventing breakage in later processing. Specialized semiconductor grinder under HTS 8461.90.60 per statistical notes.
Wafer Surface Lapper
Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.
Diamond Wafer Polishing Machine
Uses diamond slurry and pads to polish semiconductor wafers to mirror finish required for lithography. Mechanical polishing action removes cermet, placing it under HTS 8461.90.60 statistical note (a)(ii)(C).
Crystal Ingot Notcher
Machine that notches silicon ingots to precise flats indicating crystal orientation and doping. Performs slotting/planing operations removing material, thus HTS 8461.90.60 for semiconductor boule preparation.
Czochralski Crystal Puller
A machine tool used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski method. It removes excess material through precise shaping and grinding processes to achieve the required boule diameter and flats, classifying it under HTS 8461.90.60 as other semiconductor manufacturing equipment involving metal/cermet removal.