Wafer Lapping Machine from Canada
Double-sided lapping equipment that abrades both surfaces of semiconductor wafers to achieve flatness tolerances critical for fabrication. Falls under HTS 8461.90.60 per statistical note (a)(ii)(C) for wafer preparation by material removal.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include flatness specification sheets (e.g
• <1 micron) in entry docs
• Bond equipment under temporary import if for testing/demos