Wafer Lapping Machine from Japan

Double-sided lapping equipment that abrades both surfaces of semiconductor wafers to achieve flatness tolerances critical for fabrication. Falls under HTS 8461.90.60 per statistical note (a)(ii)(C) for wafer preparation by material removal.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include flatness specification sheets (e.g

• <1 micron) in entry docs

• Bond equipment under temporary import if for testing/demos