8461.90.60/Wafer Lapping Machine/Mexico

Wafer Lapping Machine from Mexico

Double-sided lapping equipment that abrades both surfaces of semiconductor wafers to achieve flatness tolerances critical for fabrication. Falls under HTS 8461.90.60 per statistical note (a)(ii)(C) for wafer preparation by material removal.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include flatness specification sheets (e.g

• <1 micron) in entry docs

• Bond equipment under temporary import if for testing/demos

Wafer Lapping Machine from Mexico — Import Duty Rate | HTS 8461.90.60