8461.90.60/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP tool that chemically and mechanically polishes wafer surfaces to atomic flatness for device fabrication. The mechanical platen removes cermet material, classifying under HTS 8461.90.60 as other semiconductor processing machine tool.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Detail slurry and platen RPM specs to distinguish from pure chemical processors

• Obtain advance classification ruling for hybrid CMP systems