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8461.90.60/Chemical Mechanical Wafer Polisher/Mexico

Chemical Mechanical Wafer Polisher from Mexico

CMP tool that chemically and mechanically polishes wafer surfaces to atomic flatness for device fabrication. The mechanical platen removes cermet material, classifying under HTS 8461.90.60 as other semiconductor processing machine tool.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Detail slurry and platen RPM specs to distinguish from pure chemical processors

• Obtain advance classification ruling for hybrid CMP systems