8461.90.60/Chemical Mechanical Wafer Polisher/Mexico

Chemical Mechanical Wafer Polisher from Mexico

CMP tool that chemically and mechanically polishes wafer surfaces to atomic flatness for device fabrication. The mechanical platen removes cermet material, classifying under HTS 8461.90.60 as other semiconductor processing machine tool.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Detail slurry and platen RPM specs to distinguish from pure chemical processors

• Obtain advance classification ruling for hybrid CMP systems