Chemical Mechanical Wafer Polisher from China
CMP tool that chemically and mechanically polishes wafer surfaces to atomic flatness for device fabrication. The mechanical platen removes cermet material, classifying under HTS 8461.90.60 as other semiconductor processing machine tool.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Detail slurry and platen RPM specs to distinguish from pure chemical processors
• Obtain advance classification ruling for hybrid CMP systems