Interposer Substrate for 2.5D IC Packaging
A silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. This substrate provides high-bandwidth interconnects between multiple dies. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, enabling advanced packaging solutions.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the interposer is a printed circuit with no active elements
Printed circuits are classified in heading 85.34, but interposers with TSVs for IC packaging are parts of ICs.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide technical documentation showing the TSV structure and its role in 2.5D packaging
• Classify the interposer as a part of ICs, not as a complete semiconductor device
• Ensure the product is not declared as a printed circuit, which would fall under heading 85.34
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