Interposer Substrate for 2.5D IC Packaging from China
A silicon interposer substrate with through-silicon vias (TSV) used in 2.5D IC packaging for heterogeneous integration of logic and memory ICs. This substrate provides high-bandwidth interconnects between multiple dies. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Duty Rate — China → Canada
0%
Import Tips
• Document the interposer's role in enabling die-to-die communication and its TSV structure
• Include technical drawings showing the via layout and metallization
• If the interposer is imported with active dies attached, it may be classified as a complete IC