Duty Rate (from China)
Subheadings
Products classified under Tariff item 8542.90.00
BGA Heat Spreader Lid for Processor ICs
A precision-machined copper or aluminum lid assembly with thermal interface material, designed to be attached to BGA integrated circuit packages. It serves as a protective and heat-dissipating component, integral to the physical structure of the IC package. As a part of electronic integrated circuits, it is classified under tariff item 8542.90.00.
Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as an integral part of an electronic integrated circuit. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Fan-Out Wafer Level Packaging Mold Frame
A precision metal mold frame used in fan-out wafer level packaging (FOWLP) compression molding processes. This frame holds the wafer during encapsulation, ensuring proper alignment and shape of the molded package. As a specialized tool for IC packaging, it is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Flip-Chip Bumps Preform Array for GPU ICs
A solder micro-bump preform array on a carrier film, used for flip-chip bonding of GPU integrated circuits. This component provides the necessary solder bumps for electrical and mechanical connection between the die and substrate. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Gold Wire Bonding Wedge Tool
A tungsten carbide wedge tool used for thermosonic gold wire bonding of IC leads to die pads. This tool is a critical consumable in the wire bonding process, shaping the wire and transmitting ultrasonic energy. It is classified under tariff item 8542.90.00 as a specialized part for electronic integrated circuit assembly.
IC Die Attach Film Frame
A pressure-sensitive adhesive film mounted on a metal frame, used for wafer dicing and IC die attachment during packaging. This film holds the wafer in place during cutting and provides a carrier for die pick-and-place operations. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
IC Package Sawing Blade Holder
A precision collet holder designed to hold diamond saw blades used in IC package singulation after molding. This holder ensures accurate cutting of molded IC packages into individual units. It is classified under tariff item 8542.90.00 as a part specific to electronic integrated circuit manufacturing.
IC Test Socket Contact Pogo Pins
Spring-loaded pogo pin contacts used in high-frequency IC test sockets, ensuring reliable electrical connection during wafer or probe testing. These pins are essential for validating IC performance before packaging. They are classified under tariff item 8542.90.00 as parts of electronic integrated circuits for test and validation.
Interposer Substrate for 2.5D IC Packaging
A silicon interposer substrate with through-silicon vias (TSV) used in 2.5D IC packaging for heterogeneous integration of logic and memory ICs. This substrate provides high-bandwidth interconnects between multiple dies. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Lid Attach Thermal Grease Dispenser Cartridge
A pre-filled syringe cartridge containing phase-change thermal interface material, used for automated IC lid attachment. This product dispenses thermal grease to improve heat transfer between the die and lid. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits for thermal management.
QFN-64 Package Substrate with Solder Balls
An organic substrate in QFN-64 format pre-attached with BGA-style solder balls, used for quad flat no-lead IC packaging. This substrate provides the electrical interconnect between the die and the printed circuit board. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Silicon Die Spacer Wafer
A thin silicon wafer with through-holes used as spacers in 3D IC stacking for precise die-to-die alignment. This spacer maintains consistent separation between stacked dies and facilitates vertical integration. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
STM32F407VGT6 Microcontroller IC Package
A replacement or spare integrated circuit package containing the STM32F407VGT6 ARM Cortex-M4 microcontroller die, used in embedded systems. This product is a complete electronic integrated circuit, not merely a part, but is presented as a spare component for existing systems. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
TSOP-48 Memory IC Lead Frame Assembly
A pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. This component is essential for connecting the memory die to external circuits. It is classified under tariff item 8542.90.00 as a specialized part of electronic integrated circuits.
Wafer Level Chip Scale Package (WLCSP) Redistribution Layer
A thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. This substrate enables fan-out packaging by redistributing electrical connections. It is classified under tariff item 8542.90.00 as a specialized part of electronic integrated circuits.