Silicon Die Spacer Wafer
A thin silicon wafer with through-holes used as spacers in 3D IC stacking for precise die-to-die alignment. This spacer maintains consistent separation between stacked dies and facilitates vertical integration. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the spacer is part of semiconductor manufacturing equipment
Parts of machines for semiconductor assembly may fall under heading 84.86.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Describe the spacer's function in maintaining die alignment and its through-hole structure
• Provide the wafer's diameter, thickness, and hole pattern specifications
• If the spacer is coated with conductive materials, note that it may be classified differently
Related Products under Tariff item 8542.90.00
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A precision-machined copper or aluminum lid assembly with thermal interface material, designed to be attached to BGA integrated circuit packages. It serves as a protective and heat-dissipating component, integral to the physical structure of the IC package. As a part of electronic integrated circuits, it is classified under tariff item 8542.90.00.
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