BGA Heat Spreader Lid for Processor ICs
A precision-machined copper or aluminum lid assembly with thermal interface material, designed to be attached to BGA integrated circuit packages. It serves as a protective and heat-dissipating component, integral to the physical structure of the IC package. As a part of electronic integrated circuits, it is classified under tariff item 8542.90.00.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the lid is specifically designed for semiconductor manufacturing equipment
Parts of machines used for semiconductor assembly may fall under heading 84.86.
If the lid is a simple aluminum article without thermal interface material
Aluminum articles not elsewhere specified could be classified in chapter 76.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the lid is declared as a part of electronic integrated circuits, not as a general metal article, to avoid misclassification
• Provide technical specifications, such as material composition and dimensions, to support the classification
• Verify whether the product qualifies for duty-free treatment under any free trade agreements
Related Products under Tariff item 8542.90.00
Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as an integral part of an electronic integrated circuit. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Fan-Out Wafer Level Packaging Mold Frame
A precision metal mold frame used in fan-out wafer level packaging (FOWLP) compression molding processes. This frame holds the wafer during encapsulation, ensuring proper alignment and shape of the molded package. As a specialized tool for IC packaging, it is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Flip-Chip Bumps Preform Array for GPU ICs
A solder micro-bump preform array on a carrier film, used for flip-chip bonding of GPU integrated circuits. This component provides the necessary solder bumps for electrical and mechanical connection between the die and substrate. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Gold Wire Bonding Wedge Tool
A tungsten carbide wedge tool used for thermosonic gold wire bonding of IC leads to die pads. This tool is a critical consumable in the wire bonding process, shaping the wire and transmitting ultrasonic energy. It is classified under tariff item 8542.90.00 as a specialized part for electronic integrated circuit assembly.
IC Die Attach Film Frame
A pressure-sensitive adhesive film mounted on a metal frame, used for wafer dicing and IC die attachment during packaging. This film holds the wafer in place during cutting and provides a carrier for die pick-and-place operations. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
IC Package Sawing Blade Holder
A precision collet holder designed to hold diamond saw blades used in IC package singulation after molding. This holder ensures accurate cutting of molded IC packages into individual units. It is classified under tariff item 8542.90.00 as a part specific to electronic integrated circuit manufacturing.