Flip-Chip Bumps Preform Array for GPU ICs
A solder micro-bump preform array on a carrier film, used for flip-chip bonding of GPU integrated circuits. This component provides the necessary solder bumps for electrical and mechanical connection between the die and substrate. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the preforms are coated with flux and presented as solder articles
Wire, rods, tubes, plates, and similar articles of solder may fall under heading 83.11.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Specify the solder composition and bump dimensions in the import documentation
• Confirm that the preform is not classified as a separate article of solder (e.g
• under heading 83.11)
• If the carrier film is included, ensure it is presented as part of the preform assembly
Related Products under Tariff item 8542.90.00
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