Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as a part of electronic integrated circuits. It is classified under tariff item 8542.90.00 as a part of semiconductor devices.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the carrier is presented as a complete electronic integrated circuit
Complete processors and controllers are classified as electronic integrated circuits, not parts.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify the EMIB carrier as a part of electronic integrated circuits, providing evidence of its role in multi-die packaging
• Include technical specifications showing the embedded traces and silicon substrate
• Ensure the product is not declared as a complete integrated circuit, which would fall under a different heading
Related Products under Tariff item 8542.90.00
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A precision-machined copper or aluminum heat spreader lid assembly with thermal interface material, designed for BGA integrated circuit packages. This lid is a component used to dissipate heat from the IC die, contributing to the functionality and reliability of the semiconductor device. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00.
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