Embedded Multi-Die Interconnect Bridge (EMIB) Carrier from United States
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as an integral part of an electronic integrated circuit. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Duty Rate — United States → Canada
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Document the technical role of the bridge carrier in multi-die packaging to justify classification as an IC part
• Include datasheets or schematics showing the embedded traces and connection functions
• Be aware that if the carrier is imported separately from the dies, it may be subject to different treatment