Embedded Multi-Die Interconnect Bridge (EMIB) Carrier from Mexico
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as a part of electronic integrated circuits. It is classified under tariff item 8542.90.00 as a part of semiconductor devices.
Duty Rate — Mexico → Canada
0%
Import Tips
• Classify the EMIB carrier as a part of electronic integrated circuits, providing evidence of its role in multi-die packaging
• Include technical specifications showing the embedded traces and silicon substrate
• Ensure the product is not declared as a complete integrated circuit, which would fall under a different heading