IC Die Attach Film Frame
A pressure-sensitive adhesive film mounted on a metal frame, used for wafer dicing and IC die attachment during packaging. This film holds the wafer in place during cutting and provides a carrier for die pick-and-place operations. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the film is presented as a self-adhesive tape or sheet
Self-adhesive plates, sheets, film, and tape of plastics are classified in heading 39.19.
If the film is part of semiconductor manufacturing equipment
Parts of machines for semiconductor assembly may fall under heading 84.86.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Describe the film's role in the IC packaging process, emphasizing its use in die handling
• Ensure the product is not classified as a general adhesive tape of chapter 39
• If the film is pre-cut to specific wafer sizes, include dimensions in the documentation
Related Products under Tariff item 8542.90.00
BGA Heat Spreader Lid for Processor ICs
A precision-machined copper or aluminum lid assembly with thermal interface material, designed to be attached to BGA integrated circuit packages. It serves as a protective and heat-dissipating component, integral to the physical structure of the IC package. As a part of electronic integrated circuits, it is classified under tariff item 8542.90.00.
Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as an integral part of an electronic integrated circuit. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Fan-Out Wafer Level Packaging Mold Frame
A precision metal mold frame used in fan-out wafer level packaging (FOWLP) compression molding processes. This frame holds the wafer during encapsulation, ensuring proper alignment and shape of the molded package. As a specialized tool for IC packaging, it is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Flip-Chip Bumps Preform Array for GPU ICs
A solder micro-bump preform array on a carrier film, used for flip-chip bonding of GPU integrated circuits. This component provides the necessary solder bumps for electrical and mechanical connection between the die and substrate. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Gold Wire Bonding Wedge Tool
A tungsten carbide wedge tool used for thermosonic gold wire bonding of IC leads to die pads. This tool is a critical consumable in the wire bonding process, shaping the wire and transmitting ultrasonic energy. It is classified under tariff item 8542.90.00 as a specialized part for electronic integrated circuit assembly.
IC Package Sawing Blade Holder
A precision collet holder designed to hold diamond saw blades used in IC package singulation after molding. This holder ensures accurate cutting of molded IC packages into individual units. It is classified under tariff item 8542.90.00 as a part specific to electronic integrated circuit manufacturing.