IC Die Attach Film Frame from Mexico
A pressure-sensitive adhesive film mounted on a metal frame, used for wafer dicing and IC die attachment during packaging. This film holds the wafer in place during cutting and provides a carrier for die pick-and-place operations. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Duty Rate — Mexico → Canada
0%
Import Tips
• Describe the film's role in the IC packaging process, emphasizing its use in die handling
• Ensure the product is not classified as a general adhesive tape of chapter 39
• If the film is pre-cut to specific wafer sizes, include dimensions in the documentation