IC Die Attach Film Frame from Japan
A pressure-sensitive adhesive film on a metal frame, used for wafer dicing and IC die attachment during packaging. This film frame holds the wafer in place during dicing and facilitates die pick-and-place. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is integral to the IC manufacturing process.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the film frame as a part of ICs, highlighting its use in wafer dicing and die attachment
• Provide documentation on the adhesive properties and frame dimensions
• Ensure the product is not classified as a plastic article of Chapter 39, which would be incorrect