Fan-Out Wafer Level Packaging Mold Frame
A precision metal mold frame used in fan-out wafer level packaging (FOWLP) compression molding processes. This frame is a specialized tooling component that shapes and encapsulates semiconductor dies during packaging. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is essential for the manufacturing of IC packages.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the mold frame is a general injection or compression mold for plastics
Molds for rubber or plastics are classified under heading 84.80, not as IC parts.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Document the mold frame's specific use in fan-out wafer level packaging to support classification as a part of ICs
• Ensure the frame is not considered a general-purpose tool, which may fall under Chapter 82
• Provide a detailed description of the molding process it supports
Related Products under Tariff item 8542.90.00
BGA Heat Spreader Lid for Processor ICs
A precision-machined copper or aluminum heat spreader lid assembly with thermal interface material, designed for BGA integrated circuit packages. This lid is a component used to dissipate heat from the IC die, contributing to the functionality and reliability of the semiconductor device. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00.
Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as a part of electronic integrated circuits. It is classified under tariff item 8542.90.00 as a part of semiconductor devices.
Flip-Chip Bumps Preform Array for GPU ICs
A solder micro-bump preform array on a carrier film, used for flip-chip bonding of GPU integrated circuits. This product provides the precise solder bumps needed for electrical and mechanical connections between the die and substrate. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, supporting high-density 3D IC stacking.
Gold Wire Bonding Wedge Tool
A tungsten carbide wedge tool used for thermosonic gold wire bonding of IC leads to die pads. This tool is a specialized part of the wire bonding process, essential for assembling electronic integrated circuits. It is classified under tariff item 8542.90.00 as a part of semiconductor devices, not as a general hand tool.
IC Die Attach Film Frame
A pressure-sensitive adhesive film on a metal frame, used for wafer dicing and IC die attachment during packaging. This film frame holds the wafer in place during dicing and facilitates die pick-and-place. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is integral to the IC manufacturing process.
IC Package Sawing Blade Holder
A precision collet holder for diamond saw blades used in IC package singulation after molding. This holder is a specialized component that secures the saw blade during the cutting process. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits, as it is essential for IC package manufacturing.