Fan-Out Wafer Level Packaging Mold Frame from United States
A precision metal mold frame used in fan-out wafer level packaging (FOWLP) compression molding processes. This frame is a specialized tooling component that shapes and encapsulates semiconductor dies during packaging. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is essential for the manufacturing of IC packages.
Duty Rate — United States → Canada
0%
Import Tips
• Document the mold frame's specific use in fan-out wafer level packaging to support classification as a part of ICs
• Ensure the frame is not considered a general-purpose tool, which may fall under Chapter 82
• Provide a detailed description of the molding process it supports