Fan-Out Wafer Level Packaging Mold Frame from China
A precision metal mold frame used in fan-out wafer level packaging (FOWLP) compression molding processes. This frame holds the wafer during encapsulation, ensuring proper alignment and shape of the molded package. As a specialized tool for IC packaging, it is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Duty Rate — China → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Clearly describe the mold frame's function in the IC packaging process to support classification as a part
• Include engineering drawings or process flow diagrams
• If the frame is reusable and not dedicated to a single IC, it may be considered equipment rather than a part