Parts
Semiconductor devices (for example, diodes, transistors, semiconductor-based transducers); photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED), whether or not assembled with other light-emitting diodes (LED); mounted piezo-electric crystals. > Other semiconductor devices: > Parts > Parts
Duty Rate (from China)
Products classified under Tariff item 8542.90.00.00
BGA Heat Spreader Lid for Processor ICs
A precision-machined copper or aluminum heat spreader lid assembly with thermal interface material, designed for BGA integrated circuit packages. This lid is a component used to dissipate heat from the IC die, contributing to the functionality and reliability of the semiconductor device. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00.
8542.90.00Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as a part of electronic integrated circuits. It is classified under tariff item 8542.90.00 as a part of semiconductor devices.
8542.90.00Fan-Out Wafer Level Packaging Mold Frame
A precision metal mold frame used in fan-out wafer level packaging (FOWLP) compression molding processes. This frame is a specialized tooling component that shapes and encapsulates semiconductor dies during packaging. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is essential for the manufacturing of IC packages.
8542.90.00Flip-Chip Bumps Preform Array for GPU ICs
A solder micro-bump preform array on a carrier film, used for flip-chip bonding of GPU integrated circuits. This product provides the precise solder bumps needed for electrical and mechanical connections between the die and substrate. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, supporting high-density 3D IC stacking.
8542.90.00Gold Wire Bonding Wedge Tool
A tungsten carbide wedge tool used for thermosonic gold wire bonding of IC leads to die pads. This tool is a specialized part of the wire bonding process, essential for assembling electronic integrated circuits. It is classified under tariff item 8542.90.00 as a part of semiconductor devices, not as a general hand tool.
8542.90.00IC Die Attach Film Frame
A pressure-sensitive adhesive film on a metal frame, used for wafer dicing and IC die attachment during packaging. This film frame holds the wafer in place during dicing and facilitates die pick-and-place. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is integral to the IC manufacturing process.
8542.90.00IC Package Sawing Blade Holder
A precision collet holder for diamond saw blades used in IC package singulation after molding. This holder is a specialized component that secures the saw blade during the cutting process. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits, as it is essential for IC package manufacturing.
8542.90.00IC Test Socket Contact Pogo Pins
Spring-loaded pogo pin contacts for high-frequency IC test sockets, ensuring reliable electrical connection during wafer or probe testing. These pins are critical for validating IC performance before packaging. They are classified as parts of electronic integrated circuits under tariff item 8542.90.00, as they are used in the IC manufacturing and testing process.
8542.90.00Interposer Substrate for 2.5D IC Packaging
A silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. This substrate provides high-bandwidth interconnects between multiple dies. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, enabling advanced packaging solutions.
8542.90.00Lid Attach Thermal Grease Dispenser Cartridge
A pre-filled syringe cartridge with phase-change thermal interface material for automated IC lid attachment. This cartridge dispenses thermal grease during the lid attachment process, ensuring proper heat dissipation. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is used in IC assembly.
8542.90.00QFN-64 Package Substrate with Solder Balls
An organic substrate in QFN-64 format pre-attached with BGA-style solder balls for quad flat no-lead IC packaging. This substrate serves as the interconnect base for the IC die, providing electrical pathways. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is a specialized component for IC packaging.
8542.90.00Silicon Die Spacer Wafer
A thin silicon wafer with through-holes used as spacers in 3D IC stacking for precise die-to-die alignment. This spacer wafer maintains proper spacing and alignment between stacked dies. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is essential for vertical integration packaging.
8542.90.00STM32F407VGT6 Microcontroller IC Package
A replacement or spare integrated circuit package containing the STM32F407VGT6 ARM Cortex-M4 microcontroller die. This product is a complete electronic integrated circuit, not a part, and is used in embedded systems. It is not classified under tariff item 8542.90.00, which covers parts, but rather as a complete IC.
8542.90.00TSOP-48 Memory IC Lead Frame Assembly
A pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. This lead frame is a specialized component for IC packaging. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is essential for the IC's electrical interface.
8542.90.00Wafer Level Chip Scale Package (WLCSP) Redistribution Layer
A thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. This substrate is a specialized component for wafer level chip scale packaging. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, enabling advanced fan-out packaging.