TSOP-48 Memory IC Lead Frame Assembly
A pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. This lead frame is a specialized component for IC packaging. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is essential for the IC's electrical interface.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
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Import Tips & Compliance
• Classify the lead frame as a part of ICs, emphasizing its role in providing electrical connections
• Provide technical specifications on the lead frame material and dimensions
• Ensure the product is not classified as a general metal article of Section XV
Related Products under Tariff item 8542.90.00
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