TSOP-48 Memory IC Lead Frame Assembly from United States
A pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. This component is essential for connecting the memory die to external circuits. It is classified under tariff item 8542.90.00 as a specialized part of electronic integrated circuits.
Duty Rate — United States → Canada
0%
Import Tips
• Specify the lead frame's material (e.g
• copper alloy) and plating (e.g
• silver or tin) to support classification
• If the lead frame is imported with a die attached, it may be classified as a complete IC
• Ensure the lead frame is not classified as a general metal article of chapter 73