Of refined copper
Aluminum bars, rods and profiles. > Backed: > Of refined copper
Duty Rate (from China)
Products classified under Tariff item 7410.21.00
Aluminum-Backed Copper Clad Laminate
Aluminum-backed copper clad laminate consisting of refined copper foil laminated to a thin aluminum substrate, used for metal-core PCBs in LED lighting. The copper foil is 0.15 mm or less in thickness, and the aluminum backing provides thermal management for high-power applications.
CEM-1 Copper Clad Board
CEM-1 copper clad board with refined copper foil cladding 0.15 mm or less on a cost-effective phenolic paper substrate, used for single-sided PCBs. The copper foil is backed by the CEM-1 material, which is a composite of paper and resin.
Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding 0.15 mm or less in thickness. The ceramic-filled polymer backing provides stable dielectric properties for high-frequency circuits.
Double-Sided 1.6mm FR4 Copper Clad Laminate
Double-sided 1.6mm FR4 copper clad laminate with refined copper foil on both sides, each foil layer 0.15 mm or less. The FR4 glass epoxy substrate provides mechanical strength and electrical insulation for PCB manufacturing.
FR-4 Copper Clad Laminate Sheet
FR-4 copper clad laminate sheet made from epoxy fiberglass substrate clad with thin refined copper foil on one or both sides, foil thickness under 0.15 mm excluding backing. Used as the base material for printed circuit boards.
High-Tg FR4 Copper Clad Laminate
High-Tg FR4 copper clad laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil less than 0.15 mm. The high-Tg resin system provides thermal stability for demanding applications.
Polyimide Copper Clad Laminate
Polyimide copper clad laminate with high-temperature polyimide film backed with refined copper foil 0.15 mm or less, used for flexible PCBs. The polyimide backing provides flexibility and thermal resistance.
Rogers RO4000 Series Copper Clad Laminate
Rogers RO4000 series copper clad laminate with PTFE-based backing clad with refined copper foil less than 0.15 mm for RF/microwave PCBs. The low-loss backing material provides excellent high-frequency performance.
Single-Sided 0.8mm FR4 PCB Laminate
Thin 0.8mm FR4 copper clad laminate with copper on one side only over glass fabric impregnated with epoxy resin, foil less than 0.15 mm thick. Used for lightweight PCB applications.
Single-Sided 1.6mm FR4 Copper Laminate
Standard 1.6mm thick FR4 glass-epoxy laminate with 1 oz copper foil (35 µm) on one side only, total foil thickness less than 0.15 mm. The FR4 backing provides flame retardancy and mechanical strength.
Single-Sided 1oz FR4 Copper Clad Board
1 oz (35 micron) copper foil on one side of FR4 glass cloth/epoxy board, excluding backing less than 0.15 mm. The FR4 substrate provides electrical insulation and mechanical support for PCB production.
Single-Sided 7628 Glass Cloth Copper Clad
Heavy 7628 glass cloth style impregnated with epoxy, clad with refined copper on one side only, foil thickness 0.15 mm or less. The glass cloth backing provides high mechanical strength for PCB applications.
Single-Sided CEM-1 Copper Clad Sheet
Copper foil laminated on one side to CEM-1 substrate (phenolic resin with glass mat and paper), thickness 0.15 mm or less. The CEM-1 backing provides a cost-effective base for single-sided PCBs.
Single-Sided Copper Clad Laminate Panel
Single-sided copper clad laminate panel with epoxy laminate base and refined copper foil on one side only, thickness 0.15 mm or less, cut to size for PCB fabrication. The epoxy backing provides insulation and mechanical support.
Thin Flex Copper Clad Polyimide Laminate
Ultra-thin polyimide copper clad laminate for flexible circuits, with refined copper foil 0.15 mm or less and adhesive backing. The polyimide film provides flexibility and thermal stability for dynamic applications.